Surface Mount International Conference & Exposition


		You're challenged daily by the expansion of the surface mount arena to include unleaded packages. Chip scale packaging technologies like BGA, CSP, DCA, and COB create a world of new opportunities, but how can you take advantage of them? The best decisions draw on many sources of information about product options and their applications. The New SMI '98 is the one event that brings together everything you need. The one event that will keep you current with a fast-paced technology and give you the edge in the race to high density. The conference will give you: More than 100 technical paper sessions The second annual Chip Scale Symposium: a whole day devoted to the practical application of unleaded assembly technology. Now included with Technical Conference registration! More networking opportunities in one week than you'd find in a year at home In this area of the site you can find all the information you need to plan your conference experience. Use the links on the left sidebar to review listings of technical sessions, tutorials and workshops organized by track or date. You can click on any session name to see a full description. SESSIONS BY TRACK \| SESSIONS BY DATE TUTORIALS BY TRACK \| TUTORIALS BY DATE KEYNOTE & SPECIAL SESSIONS \| SOCIAL EVENTS SMI HOME \| ABOUT SMI \| EXPO CONFERENCE \| SCHEDULE AT-A-GLANCE TRAVEL & HOUSING \| REGISTER NOW Design by The Page Group, Inc.